iTAC has new big data and business intelligence products on show at SMT Hybrid Packaging

MES manufacturer presents smart solutions for smart factories: from BI.Portal to IoT.Service and big data analytics

Montabaur, 25 April 2016 – iTAC Software AG is showcasing its new products for electronics manufacturing at “SMT Hybrid Packaging” in Nuremberg, Hall 7/Stand 110, from 26 - 28 April. They include a BI.Portal to cope with large amounts of data and a new IoT.Service that supports the use of the iTAC.MES in the cloud. Visitors to the fair will see how the software manufacturer is driving the convergence of production processes, intelligent data processing and analytics for smart factory applications.

“Manufacturing enterprises today have to guarantee complete, end-to-end product supply chain transparency. iTAC’s BI.Portal is capable of big data processing and analytics, delivering the manufacturing intelligence necessary to maximize transparency and optimize the production process,” explained Martin Heinz, General Manager for Germany, Austria & Switzerland at iTAC Software AG.

The iTAC.BI.Portal is a business intelligence solution for big data applications. It is based on the iTAC.ARTES middleware and is a component of the MES. With this BI technology, users are able to analyse and process data and create reports simply and quickly on handheld devices. The iTAC.BI.Portal consolidates, administrates and delivers decision-relevant information related to manufacturing intelligence, quality control and traceability via an intelligent link to the iTAC.MES.Suite database.

iTAC is also presenting the IoT.Service which supports use of the MES in the cloud. iTAC.IoT.Service is an MES application including database that is isolated in a Docker container. It allows MES functions such as traceability to be easily carried out in a public cloud data processing centre without the need for a local MES infrastructure.

The new IoT.Service, in combination with the iTAC.MES.Appliance, provides a decentralised, autonomous ‘MES in the box’ solution that works according to the ‘plug & produce’ principle. This stand-alone solution is ideal for plant manufacturers as OEM partners.   

This and other Industry 4.0 entry-level solutions for electronics manufacturers will be exhibited by iTAC at the SMT Hybrid Packaging fair in Nuremberg, Hall 7/Stand 110, from 26 to 28 April.